YS-2-001 (a latent curing agent suitable for epoxy resin curing systems)
Classification：Product Series
Classification：Electronic Materials
Classification：Accelerator type
Operator: 025-84823631 General Manager: 13601462659 Sales: 025-84823350
YS-2-001 (a latent curing agent suitable for epoxy resin curing systems)
Physical properties:
| Appearance | Light brown liquid |
| Amine value (mg KOH/g) | 90~130 |
| Solid content (wt%) | 60~64 |
| Viscosity (cps/25℃) | 800~3000 |
| Mix Ratio Example | |
| Epoxy resin
YS-2-001 |
100
20 |
| Curing time/100℃ | 8min. 40sec |
1. Standard liquid epoxy resin (E.E.W=190)
Product Advantages:
- Low-temperature heat-curing
- Excellent compatibility with resins and a long shelf life.
- Excellent adhesion
- It can serve as an accelerator for DICY or anhydride curing agents.
- Water-soluble
Applications:
- Low-temperature curing adhesive for electronic applications
- Low-temperature curing coating
- Adhesive Film (ACF: Anisotropic Conductive Film)
- Water-based curing agent
- Insufficient filling
- Bottom glue filling
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Operator: 025-84823631
General Manager: 13601462659
Sales: 025-84823350
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