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YS-2-008 is a latent epoxy resin curing accelerator primarily used in epoxy-anhydride systems. Single-component resin system can maintain long-term flow dynamics at low temperature or room temperature, and can achieve rapid and complete curing at moderate temperatures. The cured resin exhibits smooth, transparent, bubble-free surface and strong resistance to yellowing. It is suitable for the applications requiring high chromaticity and transparency, such as LED , curing encapsulating adhesives, power and electronic components.
MPPE is a new thermosetting oligomer polyphenylene ether resin. We have modified the end group of the original PPE/PPO with maleimide. The modified resin retains many advantages of the original polyphenylene ether (such as excellent mechanical and electrical properties) ,while also offers superior cross-linking performance, compatibility, and ease of processing. It can be used as a composite resin system for heat-resistant and high-frequency copper-clad laminates.
YS-2-011 is a dispersion/emulsion with aqueous polymer designed for metal coatings. This product encompasses polymer resins that can serve as organic binders in coating formulations, which also can be used as lubricants and anti-scratch additives during metal processing and usage. This modified polyolefin dispersion provides high gloss and excellent anti-corrosion properties for metal coatings and plating applications.
YS-2-003, YS-2-003-A, YS-2-003-B, YS-2-003-C
YS-2-001 is a latent curing agent specifically designed for one-component epoxy resin curing systems. It distinguishes itself from current low-temperature latent curing agents by achieving a minimum curing temperature of 80°C. Its advantages include excellent compatibility with products, ease of dissolution in epoxy resins, and user-friendly application.