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YS-2-001 (a latent curing agent suitable for epoxy resin curing systems)
- Product Description
- Physical properties
- Product Advantages
- Application
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- Commodity name: YS-2-001 (a latent curing agent suitable for epoxy resin curing systems)
YS-2-001 is a latent curing agent specifically designed for one-component epoxy resin curing systems. It distinguishes itself from current low-temperature latent curing agents by achieving a minimum curing temperature of 80°C. Its advantages include excellent compatibility with products, ease of dissolution in epoxy resins, and user-friendly application.
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Physical characteristics:
Appearance
Light brown liquid
Amine value (mgKOH/g)
90~130
Solid content (wt%)
60~64
Viscosity (cps/25 ℃)
800~3000
Example of Mixing Ratio
Epoxy resin
YS-2-001
100
20
Curing time/100 ℃
8min. 40sec
1.Standard liquid epoxy resin (E.E.W=190)
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Product Advantages:
- Cures with low-temperature heating
- Excellent compatibility with resins, ensuring a long shelf life
- Superior adhesion properties
- Can act as an accelerator for DICY or anhydride curing agents
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Applications:
- Low-temperature curing adhesives for electronic applications
- Low-temperature curing coatings
- Adhesive films (ACF: Anisotropic Conductive Film)
- Water-based curing agents
- Underfill
- Bottom fill adhesives
Product Introduction
Product Inquiry
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Contact Information
Switchboard:025-84823631
Sales:025-84823350
General Manager:13601462659
Email:admin@yspharma.com
Address: Rooms 404–408 and 309–313, Building F7, Jiangsu Life Science Innovation Park, No. 9 Weidi Road, Xianlin Subdistrict, Qixia District, Nanjing, Jiangsu Province
Copyright © 2026 Yuanshu Pharmaceutical Technology Co., Ltd.
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