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YS-2-001 (a latent curing agent suitable for epoxy resin curing systems)

YS-2-001 is a latent curing agent suitable for epoxy resin curing systems, specifically designed for one-component formulations. Unlike conventional low-temperature latent curing agents, it can achieve effective curing at as low as 80°C. Its advantages include excellent product compatibility, easy solubility in epoxy resins, and convenient handling.

Category:

Product Series

Electronic materials

Accelerator type

025-84823350

Related documents:

Product Inquiry
  • Product Description
  • Physical properties
  • Product Advantages
  • Application
    • Commodity name: YS-2-001 (a latent curing agent suitable for epoxy resin curing systems)

    YS-2-001 is a latent curing agent suitable for epoxy resin curing systems, specifically designed for one-component formulations. Unlike conventional low-temperature latent curing agents, it can achieve effective curing at as low as 80°C. Its advantages include excellent product compatibility, easy solubility in epoxy resins, and convenient handling.

    Physical properties:

    Appearance Light brown liquid
    Amine value (mg KOH/g) 90~130
    Solid content (wt%) 60~64
    Viscosity (cps/25℃) 800~3000

     

      Mix Ratio Example

    Epoxy resin

     

    YS-2-001

    100

     

    20
    Curing time/100℃ 8min. 40sec

    1. Standard liquid epoxy resin (E.E.W=190)

     

    Product Advantages:

    1. Low-temperature heat-curing
    2. Excellent compatibility with resins and a long shelf life.
    3. Excellent adhesion
    4. It can serve as an accelerator for DICY or anhydride curing agents.
    5. Water-soluble

    Applications:

    1. Low-temperature curing adhesive for electronic applications
    2. Low-temperature curing coating
    3. Adhesive Film (ACF: Anisotropic Conductive Film)
    4. Water-based curing agent
    5. Insufficient filling
    6. Bottom glue filling

     

Product Introduction

Physical properties:

Appearance Light brown liquid
Amine value (mg KOH/g) 90~130
Solid content (wt%) 60~64
Viscosity (cps/25℃) 800~3000

 

  Mix Ratio Example

Epoxy resin

 

YS-2-001

100

 

20
Curing time/100℃ 8min. 40sec

1. Standard liquid epoxy resin (E.E.W=190)

 

Product Advantages:

  1. Low-temperature heat-curing
  2. Excellent compatibility with resins and a long shelf life.
  3. Excellent adhesion
  4. It can serve as an accelerator for DICY or anhydride curing agents.
  5. Water-soluble

Applications:

  1. Low-temperature curing adhesive for electronic applications
  2. Low-temperature curing coating
  3. Adhesive Film (ACF: Anisotropic Conductive Film)
  4. Water-based curing agent
  5. Insufficient filling
  6. Bottom glue filling

 

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Methotrexate intermediate

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