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PHA

PHA is a next-generation halogen-free and antimony-free reactive phosphazene flame retardant specifically engineered for high-performance thermosetting resin systems. The molecule incorporates reactive allyl functional groups, enabling participation in the resin curing process and the formation of covalent bonds with the resin matrix. This reactive mechanism fundamentally eliminates the limitations commonly associated with conventional additive flame retardants, such as migration, blooming, and inadequate long-term durability. PHA delivers an outstanding balance of flame-retardant efficiency, thermal stability, and electrical performance, making it particularly well suited for advanced applications including high-frequency/high-speed electronic materials, aerospace composites, and premium copper-clad laminates (CCLs).

Category:

Flame retardant

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Product Description
Physical properties
Product Advantages
Application

- Commodity name: PHA
PHA is a next-generation halogen-free and antimony-free reactive phosphazene flame retardant specifically engineered for high-performance thermosetting resin systems. The molecule incorporates reactive allyl functional groups, enabling participation in the resin curing process and the formation of covalent bonds with the resin matrix. This reactive mechanism fundamentally eliminates the limitations commonly associated with conventional additive flame retardants, such as migration, blooming, and inadequate long-term durability. PHA delivers an outstanding balance of flame-retardant efficiency, thermal stability, and electrical performance, making it particularly well suited for advanced applications including high-frequency/high-speed electronic materials, aerospace composites, and premium copper-clad laminates (CCLs).
Thermal Stability Analysis (TGA, N₂, 10°C/min)：

Sample

T1

T2

T5

PHA-9-11

234℃

274℃

304℃

Processing Guidelines：
- Recommended Dosage: 6–25 wt% of total resin content.
- Compatible Systems: BMI, DABA, and epoxy resin systems.
- Reactive Curing: Chemically incorporated into the resin network during thermal curing.
- Solubility: Readily soluble in MEK and toluene for prepreg and resin solution preparation

Appearance	Yellow to brown liquid
Physical State (25°C)	Viscous liquid
Phosphorus Content	~11 wt%
T₅ (5% Weight Loss Temperature)	> 300℃
Hydrolytic Stability	Superior to phosphate esters such as BDP, RDX, and TPP
Reactive Functional Group	Allyl group (reactive with maleimides)
Solubilit	Soluble in various organic solvents, including MEK and toluene
Dielectric Constant（Dk）	2.6632
Dielectric Loss（Df）	0.0006633

Product Advantages:

Environmentally Friendly Halogen-Free Design：Free of halogens and antimony compounds, compliant with green electronics requirements.

Reactive Flame-Retardant Mechanism：Reactive allyl groups enable chemical bonding with BMI and other resin systems, permanently integrating the flame-retardant component into the resin network.

Ultra-Low Migration： Prevents blooming associated with conventional additive flame retardants, ensuring long-term performance stability and extended service life.

Excellent Thermal Stability：T₅ > 300°C, suitable for high-temperature processing and high-Tg resin systems.

Outstanding Electrical Performance： Minimal impact on dielectric properties and low dielectric loss, ideal for high-frequency, high-speed applications.
Applications:

Electronics & Information Technology： High-frequency/high-speed copper-clad laminates (CCLs), electronic packaging materials, and high-reliability PCB substrates

High-Performance Resin Systems：Bismaleimide (BMI) resins, BT resins (BMI–triazine resins), naphthalene-based epoxy resins, and bisphenol F epoxy resins.

Advanced Composite Materials： Carbon fiber reinforced polymers (CFRPs), aerospace structural materials, and composite materials for rail transit applications.

Industrial Adhesives： Structural adhesives, high-temperature-resistant adhesives, and electronic-grade adhesive materials

Product Introduction

Thermal Stability Analysis (TGA, N₂, 10°C/min)：

Sample	T1	T2	T5
PHA-9-11	234℃	274℃	304℃

Processing Guidelines：

Recommended Dosage: 6–25 wt% of total resin content.
Compatible Systems: BMI, DABA, and epoxy resin systems.
Reactive Curing: Chemically incorporated into the resin network during thermal curing.
Solubility: Readily soluble in MEK and toluene for prepreg and resin solution preparation

None

PHH-L Polymeric Flame Retardant