With electronic materials as the core, while also focusing on the development of highly challenging pharmaceutical intermediates.

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PHH is a highly efficient, environmentally friendly halogen-free phosphazene-based flame retardant, exhibiting excellent thermal stability, hydrolytic resistance, and electrical properties. It is suitable for a wide range of thermoplastic and thermosetting resin systems and is particularly well suited for high‑end applications such as electronics, semiconductors, and telecommunications equipment.

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MHB‑1 is a hydrazine‑based aqueous formulation, primarily used as the main brightener in alkaline zinc plating and zinc–nickel alloy plating processes. It is compatible with zinc–nickel alloy electroplating and suitable for the pretreatment of plastic substrates prior to metallization. Compared with conventional benzyl nicotinate salts, MHB‑1 delivers superior plating performance, yielding a bright, fine, and white‑appearing deposit that exhibits enhanced corrosion resistance, improved current efficiency, greater bath stability, and extended bath life.

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PEB, 1,4-bis(2‑epoxypropyl)benzene, is a member of the DVBDO family, and its polymers hold significant potential for applications in epoxy grouting materials and packaging materials. Moreover, it serves as an excellent reactive diluent or can be used independently as an epoxy resin matrix; when blended with other materials, it enables the fabrication of epoxy‑based composites that find use in advanced active optical materials, integrated circuit encapsulants, and fiber‑reinforced composites.

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PAF is a low-viscosity, high-purity, highly functional amine resin. This product is particularly effective in a wide range of formulation applications, including adhesives, laminating systems, coatings, and composite systems, offering excellent properties such as heat resistance, flame retardancy, and low viscosity.

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YS-2-800 is a water-based polymer dispersion and emulsion. It is recommended for use in ink/water-based varnishes, wood coatings, leather finishes, metalworking, and other industries, offering excellent wear resistance, scratch resistance, smoothness, anti‑sticking properties, high gloss, and superior corrosion protection.

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YS-2-010 is a liquid curing agent suitable for epoxy resin curing systems, imparting the cured material with a transparent, colorless, and smooth finish. It offers superior performance in heat resistance and color stability, making it particularly well suited for optoelectronic materials such as LEDs.

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YS-2-008 is a potential epoxy resin curing accelerator that primarily functions in epoxy–anhydride systems. It enables single-component resin systems to maintain long-term flow dynamics at low and ambient temperatures, while achieving rapid and complete cure at moderate temperatures. The cured resin exhibits a smooth, transparent surface free of bubbles and demonstrates excellent resistance to yellowing. It is suitable for curing encapsulating resins that demand high color purity and transparency, such as those used in LEDs, as well as for curing encapsulant adhesives for optical fibers, power supplies, and electronic components.

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